Thermal Interface Material
Zeon's VB200 is a high-performance, sheet-type Thermal Interface Material (TIM) designed to efficiently transfer heat away from components like CPUs and semiconductors. It uses a special elastomer, providing very low thermal conductivity, compressibility, and stability under long-term thermal stress, making it ideal for electronics.
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Zeon’s Thermal Interface Material VB 200 at a glance
Very good Thermal performance
- Very low Thermal resistance
- The preferred solution for high heat dissipation applications
- Provides sufficient performance margins for future requirements
Engineered for reliable performance under extreme conditions
- No pump-out or dry-out over lifetime, enabling sustained performance
- Litte to no maintenance over lifetime
- Showing consistent performance in µHAST and Thermal cycling testing
TIM in sheet form
- Ready-to-use pick-and-place solution
- No mixing, no curing, no special storage conditions required
- Saving cost and time in challenging production environment
Wide-Ranging applications
- IC tester, NAND etcher
- CPU,- GPU-, ECU-cooling
- Lighting, ADAS and more…
What is a Thermal Interface Material?
A Thermal Interface Material (TIM) is applied between two solid surfaces to support effective heat transfer in electronic assemblies.
In applications such as CPUs, GPUs, and automotive ECUs, TIMs are used between the chip and a heat sink. Although these surfaces appear smooth, microscopic surface irregularities create air gaps at the interface. Because air has low thermal conductivity, these gaps increase thermal resistance and limit heat dissipation.
TIMs are designed to fill these interfacial gaps, improving thermal contact and enabling more efficient heat flow from the chip to the heat sink. By reducing thermal resistance, TIMs contribute to controlled operating temperatures, system reliability, and consistent performance across a wide range of electronic applications.
Thermal Resistance
Thermal resistance defines how efficiently a material manages heat flow. Materials with low thermal resistance enable rapid, reliable heat transfer. This enhances performance, improves thermal efficiency, and supports high‑demand applications.
ZEON’s advanced thermal interface material (TIM) delivers very low thermal resistance, empowering high‑power chips to operate at peak performance. By enabling fast, continuous, and highly reliable heat dissipation, ZEON’s TIM helps protect critical components, maximize system reliability, and keep operating temperatures safely under control.
Thermal resistance is specified for different pressures. The pressure results from fastening the heat sink to the PCB. The higher the allowable pressure, the more heat can be dissipated. However, PCB and/or solder joints often cannot tolerate more than 0,3 MPa.
Thermal Conductivity
Thermal conductivity describes a material’s intrinsic ability to conduct heat internally. However, it is not a reliable indicator of real-world heat transfer performance, as it does not account for factors such as surface area or contact quality. As a result, two materials with identical thermal conductivity values can perform differently in practical applications.
We therefore consider thermal conductivity to be only a first, indicative property for estimating a TIM’s thermal performance. Thermal Resistance, by contrast, is the more relevant property for evaluating actual performance in an application.
Don’t let figures above 1.000 impress you. Such values very often refer to conductivity along the surface (in-plane, x-y direction) rather than perpendicular (z-direction) to the surface. These materials may spread heat across the surface, but they do not necessarily transfer it effectively to the heat sink.
Thermal conductivity
vs.
Thermal Resistance
| Property | Unit | Value |
|---|---|---|
| Bulk Thermal conductivity | W/m • K | 38 (z-direction) |
| Thermal Resistance* | cm2 • K/W | 0,07 |
| Available Thickness (d)** | µm | 100 to 260 |
| Operating Temperature | °C | -55 to 150 |
| Compressibility*** | % | 11 |
| Max. sheet size** | mm | 150 x 150 |
| Trimmable by blade tools | – | yes |
| Electrically insulating | – | no |
| Flammability UL94 | – | V-0 |
* ASTM D5470, d = 100 µm, T = 50°C, Pressure = 0,3 MPa
** For thicknesses and sheet size outside this range, please contact us.
*** d = 100 µm, T = 50°C, Pressure = 0,3 MPa
The information is based on our current knowledge and experience. It does not constitute a legally binding warranty or guarantee. Users must determine the product’s suitability for their intended application and ensure compliance with applicable EU laws and regulations. Any liability is excluded to the extent permitted by mandatory law.
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Expert advice
The best technical support comes from chemists with years of hands-on experience. Contact us now!