Thermal Interface Material

Zeon's VB200 is a high-performance, sheet-type Thermal Interface Material (TIM) designed to efficiently transfer heat away from components like CPUs and semiconductors. It uses a special elastomer, providing very low thermal conductivity, compressibility, and stability under long-term thermal stress, making it ideal for electronics.

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Zeon’s Thermal Interface Material VB 200 at a glance

Very good Thermal performance

Very low Thermal resistance
The preferred solution for high heat dissipation applications
Provides sufficient performance margins for future requirements

Engineered for reliable performance under extreme conditions

No pump-out or dry-out over lifetime, enabling sustained performance
Proven, consistent performance after uHAST and Thermal cycling testing
Litte to no maintenance over lifetime

TIM available in sheet form offers

Ready-to-use pick-and-place solution
No mixing, no curing, no special storage conditions required
Saving cost and time in challenging production environment

Wide-Ranging applications

IC tester, NAND etcher
CPU,- GPU-, ECU-cooling
Lighting, ADAS and more…

What is a Thermal Interface Material?

A Thermal Interface Material (TIM) is applied between two solid surfaces to support effective heat transfer in electronic assemblies.

In applications such as CPUs, GPUs, and automotive ECUs, TIMs are used between the chip and a heat sink. Although these surfaces appear smooth, microscopic surface irregularities create air gaps at the interface. Because air has low thermal conductivity, these gaps increase thermal resistance and limit heat dissipation.

TIMs are designed to fill these interfacial gaps, improving thermal contact and enabling more efficient heat flow from the chip to the heat sink. By reducing thermal resistance, TIMs contribute to controlled operating temperatures, system reliability, and consistent performance across a wide range of electronic applications.

Thermal Resistance over Pressure

Thermal resistance defines how efficiently a material manages heat flow. Materials with low thermal resistance enable rapid, reliable heat transfer. This enhances performance, improves thermal efficiency, and supports high‑demand applications.

ZEON’s advanced thermal interface material (TIM) delivers very low thermal resistance, empowering high‑power chips to operate at peak performance. By enabling fast, continuous, and highly reliable heat dissipation, ZEON’s TIM helps protect critical components, maximize system reliability, and keep operating temperatures safely under control.

Thermal resistance is specified for different pressures. The pressure results from fastening the heat sink to the PCB. The higher the allowable pressure, the more heat can be dissipated. However, PCB and/or solder joints often cannot tolerate more than 0.3 MPa.

Thermal Resistance

Thermal conductivity describes a material’s intrinsic ability to conduct heat internally. However, it is not a reliable indicator of real-world heat transfer performance, as it does not account for factors such as surface area or contact quality. As a result, two materials with identical thermal conductivity values can perform differently in practical applications.

We therefore consider thermal conductivity to be only a first, indicative property for estimating a TIM’s thermal performance. Thermal Resistance, by contrast, is the more relevant property for evaluating actual performance in an application.

Don’t let figures above 1,000 impress you. Such values very often refer to conductivity along the surface (in-plane, x-y direction) rather than perpendicular (z-direction) to the surface. These materials may spread heat across the surface, but they do not necessarily transfer it effectively to the heat sink.

Thermal conductivity

vs.

Thermal Resistance

Maintains comparable performance even after thermal cycling

Thermal cycling Testing assembly

Lid: 10 x 10 mm, d = 2 mm
TIM: 10 x 10 mm, d = 0.1 mm
Dummy Silicon: 10 x 10 mm, d = 0.7 mm

Temperature cycle

Temperature: −55°C to 125°C
Dwell time: 10 minutes

Measurement

ASTM D5470
Testing assembly
Temperature: 50°C
Pressure: 0.3 MPa

Unbiased Highly Accelerated Stress Test (uHAST)

Testing assembly